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Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

 Sumber daya perusahaan sekitar Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

September 16, 2025 News — With the rapid development of Industry 4.0 and IoT technology, the demand for device I/O expansion capabilities is increasingly growing. The MCP23017-E/SS 16-bit I/O expander chip launched by Shenzhen Anxinruo Technology Co., Ltd., with its powerful interface expansion capabilities and flexible configuration options, is becoming an important choice for industrial control, smart home, and IoT devices.

 

I. Core Technical Features

 

The MCP23017-E/SS utilizes an I²C interface to achieve 16-bit I/O expansion, supporting up to 8 device cascades through 3 address pins, and offers 400kHz high-speed communication with configurable interrupt output. The chip features 16 independently programmable GPIOs, supporting input/output direction setting, internal pull-up resistors, and polarity inversion. With an operating voltage range of 2.7V-5.5V, each I/O port can provide 25mA drive current, and power consumption in standby mode is below 1μA. Housed in an SSOP-28 industrial-grade package, it provides a comprehensive interface expansion solution for embedded systems. 

 

II. Functional Block Diagram Detailed Explanation

 

Core Functional Modules                                                                          

1.Communication Interface Module

I²C serial interface

SCL: Serial clock input pin

SDA: Bidirectional serial data line

Supports standard mode (100kHz) and fast mode (400kHz)

Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

2.Address Decoding Module: 3-bit hardware address supports 8-device cascading
3.Interrupt Control Module: Provides dual interrupt outputs (INTA/INTB)
4.Data Conversion Module: Implements serial-to-parallel data conversion
5.GPIO Module: 16-bit programmable I/O ports
6.Register Bank: Stores configuration parameters and control status

 

Workflow
 

1.Initialization Configuration

Configure control registers via I²C interface

Set I/O direction, pull-up resistors, and other parameters

 

2.Data Communication

Host sends control commands and data via I²C

Serializer converts serial data to parallel data

Configuration registers update corresponding settings

 

3.Interrupt Handling

GPIO state changes trigger interrupt logic

INTA/INTB pins send interrupt signals to the host

Host reads interrupt flag register to determine the interrupt source

 

Feature Advantages:

High Integration: 16-bit I/O expansion implemented in a single chip

Flexible Configuration: Each I/O port can be independently programmed

Low Power Consumption: Standby current < 1μA

Strong Drive Capability: 25mA drive current per port

 

III. Detailed Communication Timing

 

1. Byte Write Operation

Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

Timing Description:

Start Condition (S): Master generates start signal

Device Opcode (OP): 7-bit device address (0100AAA) + write flag bit (0)

Register Address (ADDR): Specifies target register for writing

Data Input (DIN): Data to be written to the register

Stop Condition (P): Master generates stop signal

 

2. Sequential Write Operation

 

 

Timing Description:

Start Condition (S): Host generates start signal

Device Opcode (OP): 7-bit device address + write flag bit

Register Address (ADDR): Specifies starting register address

Data Input (DIN): Continuously writes multiple data with auto-incrementing address

Stop Condition (P): Host generates stop signal

 

3. Key Signal Definitions

 

Symbol

Meaning

 

Description
S

Start Condition

Start signal
SR

Repeated Start

Repeated start signal

P Stop Condition Stop signal
W Write Bit (0) Write operation flag
R Read Bit (1) Read operation flag
OP Device Opcode Device operation code (0100AAA + R/W)
ADDR Register Address Register address
DIN Data Input Input data (Host → MCP23017)
DOUT Data Output Output data (MCP23017 → Host)

 

4. Timing Characteristics Parameters

Communication Rate: Supports 100kHz (standard mode) and 400kHz (fast mode)

Data Validity: SDA data must remain stable during SCL high level

Start Condition: SDA transitions from high to low while SCL is high

Stop Condition: SDA transitions from low to high while SCL is high

 

5. Application Notes

Device Address: 0100AAA, where AAA is determined by A2/A1/A0 pins

Data Transmission: MSB first, 8-bit data + 1-bit ACK

Acknowledge Signal: Receiver generates ACK signal after each byte

Timing Requirements: Must meet I²C specification parameters (tSU, tHD, etc.)

 

This timing diagram illustrates the complete I²C communication protocol of the MCP23017-E/SO, providing accurate timing references for device programming and system integration.

 

IV. Pin Configuration Description

 

GPIO Port Pins

 

 

PORT B (GPB) - Pins 1 to 8

PORT A (GPA) - Pins 21 to 28

GPB0 (Pin 1)

GPA7 (Pin 21)

GPB1 (Pin 2)

GPA7 (Pin 22)

GPB2 (Pin 3)

GPA7 (Pin 23)

GPB2 (Pin 4)

GPA7 (Pin 24)

GPB2 (Pin5)

GPA7 (Pin 25)

GPB2 (Pin 6)

GPA7 (Pin 26)

GPB2 (Pin 7)

GPA7 (Pin 27)

GPB2 (Pin 8)

GPA7 (Pin 28)

 

1.Power Pins

VDD (Pin 9): Positive power supply input (2.7V to 5.5V)

VSS (Pin 10): Power ground

 

2.Control and Configuration Pins

RESET (Pin 18): Reset input (active low)

INTA (Pin 19): PORT A interrupt output

INTB (Pin 20): PORT B interrupt output

 

Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

3.Address Configuration Pins

A0 (Pin 15): I2C address selection bit 0

A1 (Pin 16): I2C address selection bit 1

A2 (Pin 17): I2C address selection bit 2

 

4.Special Pins

NC (Pins 11, 14): No connection

Thermal Pad (Bottom): Heat dissipation pad, must be grounded

 

5.Package Characteristics

Package Type: SOIC-28

Pin Pitch: 1.27mm

Operating Temperature: -40°C to +85°C

Thermal Design: Bottom thermal pad must be connected to PCB ground plane

 

This pin configuration adopts the standard SOIC-28 package, providing a reliable I/O expansion solution for industrial control and embedded systems. All GPIO pins support independent configuration and 25mA drive capability.

 

V. I²C Device Protocol Detailed Explanation

 

Protocol Operation Modes

1. Single-Byte Write Operation

2. Multi-Byte Sequential Write Operation

3. Single-Byte Read Operation

4. Multi-Byte Sequential Read Operation

5. Mixed Operation Mode

Multi-Device Networking Application MCP23017E/SS I2C Cascading Technology Analysis

Key Protocol Features

 

Address Pointer Management

Address pointer automatically updates during write operations

Pointer auto-increments during sequential read/write operations

Supports continuous access across register boundaries

 

Data Validity

Data remains stable during SCL high level

Each byte requires an acknowledgment (ACK/NACK)

MSB-first transmission

 

Error Handling Mechanism

Slave non-acknowledgment (NACK) detection

Bus timeout protection

Clock stretching support

 

Timing Requirements

 

Parameter

StandardMode

Fast Mode

SCLFrequency

100kHz

400kHz

Setup Time

250ns

100ns

Hold Time

300ns

90ns

 

 

This protocol is fully compatible with the standard I²C specification, providing flexible data transmission methods that support both single-byte and burst transfer modes. It enables efficient configuration and control of all functional registers in the MCP23017.