K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
manufacturer:
SK Hynix
Description:
K4Z80325BC-HC14 BGA-180 Electronic Component Memory Ball Planting Tin Steel Mesh test Chip Brand New and Original
Category:
Memory IC
Price:
CN¥1.44/pieces
Specifications
Features:
Original
Application:
Industrial Consumption, All Kinds Of Electronic Products
Product Completion Type:
IC
Series:
K4Z80325
Mounting Type:
SMD/SMT
Description:
Memory Chip
Manufacturing Date Code:
23+
Functional Application:
Standard
Output Voltage:
Standard
Output Type:
Standard
LEAD TIME:
1-3 Working Days
Service:
One Stop Bom Service
Datasheet:
Please Contact Us!
Inverter:
Please Contact Us!
Condition:
Original 100%
Warranty:
1-3 Years
Shipping By:
DHL\UPS\Fedex\EMS\HK Post
Detalis:
Detalis
MOQ:
1 Pcs
Highlight:
BGA-180 Memory IC
,K4Z80325BC-HC14 Memory IC
,K4Z80325BC-HC14 Memory chip
Introduction
Product Description
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Product type:
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Steel mesh with ball planting and tin planting.
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Model Number:
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K4Z80325BC-HC14
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Series:
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K4Z80325
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Vendor:
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SAMSUNG
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Packaging:
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BGA-180
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Install the style:
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SMD/SMT
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New and original
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K4Z80325BC-HC14 BGA-180 Steel mesh with ball planting and tin planting is one of our best-selling IC chips
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Contact Person:
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Mr.Guo
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Tel:
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+86 13434437778
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Email:
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XCDZIC@163.COM
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Wechat:
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0086 13434437778
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Packing & Delivery
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Quantity(pieces)
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1-100
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100-1000
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1000-10000
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Lead time (days)
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3-5
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5-8
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To be negotiated
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Company Profile
FAQ
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