Shenzhen Anxinruo Technology Co., Ltd. Company resources

V. Package Pin Configuration DescriptionSeptember 5, 2025 News — With the increasing demand for precision measurement in industrial automation and IoT applications, high-resolution analog-to-digital converters have become core components of various sensing systems. The ADS1230IPWR 24-bit ΔΣ analog-to-digital converter, with its exceptional noise performance and low-power characteristics, is providing reliable signal conversion solutions for precision weighing, pressure detection, and industrial measurement applications. The device supports a wide power supply range of 2.7V to 5.3V, integrates a programmable gain amplifier and internal oscillator, and achieves up to 23.5 effective bits at a 10SPS output rate.   I. Core Technical Features   1.High-Precision Conversion Performance The ADS1230IPWR utilizes advanced ΔΣ modulation technology to deliver 24-bit no-missing-code accuracy. At a 10SPS data output rate, it achieves 23.5 effective bits of resolution, meeting the stringent requirements of precision weighing and pressure measurement applications. The device's built-in low-noise PGA ensures signal integrity during small-signal amplification.    2.Integrated Design This ADC integrates a complete measurement front-end, including a programmable gain amplifier, second-order ΔΣ modulator, and digital filter. The internal oscillator eliminates the need for external clock components, further simplifying system design. The device also provides additional features such as a temperature sensor and power-down mode.   3.Low-Power Characteristics Utilizing a proprietary low-power architecture, it consumes only 1.3mW typically at a 5V supply voltage. Supports multiple power-saving modes, including standby and power-down modes, significantly extending runtime in battery-powered applications.   II. Typical Characteristics Description   According to the manufacturer's test data, the ADS1230IPWR demonstrates excellent noise performance under typical operating conditions. The test conditions are: ambient temperature +25°C, analog supply voltage (AVDD) and digital supply voltage (DVDD) both at 5V, reference voltage (REFP) at 5V, and reference negative (REFN) connected to analog ground (AGND).   Noise Performance Analysis Figure 1: Noise Performance at 10SPS Data Rate Gain Setting: PGA = 64 Data Output Rate: 10SPS Noise Performance: Output code fluctuation remains within ±2 LSB Feature: Extremely high stability in low-speed sampling mode, suitable for high-precision measurement applications   Figure 2: Noise Performance at 80SPS Data Rate Gain Setting: PGA = 64 Data Output Rate: 80SPS Noise Performance: Output code fluctuation is approximately ±4 LSB Feature: Maintains good noise performance even at higher sampling rates, meeting rapid measurement requirements     Performance Summary The device exhibits excellent noise characteristics at the high gain setting of PGA=64, whether at 10SPS or 80SPS data rates. The 10SPS mode demonstrates superior noise performance, making it ideal for applications with extremely high precision requirements. The 80SPS mode provides a good balance between speed and accuracy, suitable for applications requiring faster sampling rates. Test data confirms the device's reliability and stability in precision measurement applications.   These characteristics make the ADS1230IPWR particularly suitable for applications requiring high-precision analog-to-digital conversion, such as electronic scales, pressure sensors, and industrial process control.   III. Core Analysis of Functional Block Diagram   1.Signal Processing Channel Differential Input: AINP/AINN directly connect to sensor signals Programmable Gain: 64/128× gain options to optimize small-signal amplification High-Precision Conversion: ΔΣ modulator achieves 24-bit no-missing-code conversion   2.Reference and Clock Reference Input: REFP/REFN support external reference sources Clock System: Built-in oscillator supports selectable 10/80SPS rates   3.Power Design Independent Power Supply: AVDD (Analog) and DVDD (Digital) with separate power inputs Ground Separation: AGND and DGND with independent grounding to reduce noise interference   4.Core Advantages High Integration: Reduces external component requirements Low-Noise Design: Noise < ±2 LSB at PGA=64 Low-Power Operation: Typical power consumption of 1.3mW Flexible Configuration: Programmable gain and data rate   This architecture provides a complete front-end solution for precision measurement, particularly suitable for weighing and pressure detection applications.   IV. Simplified Reference Input Circuit Analysis   Circuit Structure Description   The ADS1230IPWR adopts a differential reference voltage input design, comprising two main input terminals:   REFP:   Reference positive voltage input REFN:   Reference negative voltage input     Core Design Features   1.High-Impedance Input: Reference inputs feature high-impedance design Minimizes loading effects on the reference source Ensures reference voltage stability   2.Differential Architecture Advantages: Suppresses common-mode noise interference Improves reference voltage noise rejection ratio Supports floating reference applications   3.Decoupling Requirements A decoupling capacitor must be configured between REFP and REFN Recommended: 10μF tantalum capacitor in parallel with a 100nF ceramic capacitor Effectively suppresses power supply noise   Operating Characteristics Input Range: The reference voltage difference (REFP - REFN) determines the ADC full scale Impedance Characteristic: Typical input impedance >1MΩ Temperature Drift Impact: Reference source temperature drift directly affects conversion accuracy   V. Package Pin Configuration Description   Power Management Pins: Pin 1 (DVDD): Digital power supply positive terminal. Operating voltage range: 2.7-5.3V Pin 2 (DGND): Digital ground Pin 12 (AVDD): Analog power supply positive terminal. Operating voltage range: 2.7-5.3V Pin 11 (AGND): Analog ground   Analog Interface Pins: Pin 7 (AINP): Analog signal non-inverting input Pin 8 (AINN): Analog signal inverting input Pin 10 (REFP): Reference voltage positive input Pin 9 (REFN): Reference voltage negative input Pins 5-6 (CAP): Reference decoupling capacitor connection   Package Characteristics Type: TSSOP-16 Pin Pitch: 0.65mm Dimensions: 5.0×4.4mm Temperature Range: -40℃ to +105℃   Design Key Points Analog/digital power supplies require independent power sources Reference sources should adopt low-noise design Recommend parallel connection of 0.1μF decoupling capacitors to AVDD/DVDD pins Analog traces should be kept away from digital signal paths   This configuration provides a complete interface solution for high-precision ADC applications, particularly suitable for weighing systems and sensor measurement applications.   VI. Simplified Functional Diagram Analysis   Bypass Capacitor Filter Circuit The device constructs a low-pass filter using an external capacitor and an internal resistor: 1.External Component: 0.1μF bypass capacitor (CEXT) 2.Internal Structure: Integrated 2kΩ resistor (RINT) 3.Filter Characteristics: Forms a first-order low-pass filter 4.Cutoff Frequency: Calculated as 5.fc=12πRINTCEXT≈796Hzfc​=2πRINT​CEXT​1​≈796Hz 6.Functional Role: Effectively suppresses high-frequency noise and improves analog signal quality   Programmable Gain Amplifier (PGA) Architecture The PGA adopts a fully differential design structure: 1.Input Method: Supports differential signal input 2.Gain Configuration: Gain multiplier selected via external pins 3.Signal Processing: Utilizes chopper stabilization technology to reduce offset voltage 4.Noise Optimization: Built-in filtering network to optimize noise performance   Operating Characteristics The low-pass filter effectively suppresses high-frequency noise ≥800Hz The PGA provides high common-mode rejection ratio (CMRR) The overall architecture significantly improves signal chain noise performance Suitable for weak signal amplification scenarios such as load cell applications   Design Recommendations Use ceramic capacitors with stable temperature characteristics Minimize capacitor lead length Recommend X7R or X5R dielectric capacitors Place capacitors as close as possible to device pins during layout   VII. Clock Source Equivalent Circuit Analysis   Circuit Structure Composition The clock system adopts a dual-mode design architecture, comprising the following main modules:   Internal Oscillator Core Frequency: 76.8kHz RC oscillator Enable Control: Activated/deactivated via EN signal Automatic Detection: CLK_DETECT module monitors clock status   External Clock Interface Input Pin: CLKIN supports external clock input Compatibility: Compatible with square wave or sine wave clock sources Level Requirements: CMOS/TTL level compatible   Selection Switch Multiplexer (MUX): S0 control signal selects the channel Switching Logic: Selects internal or external clock source based on configuration Output Path: Transmits the selected clock to the ADC converter     Operating Modes     Internal Clock Mode   External Clock Mode   S0 selects the internal oscillator path   S0 selects the CLKIN input path   Provides a stable 76.8kHz reference clock   Supports external precision clock sources   No external components required, simplifying system design   Enables multi-device synchronous sampling   Configuration Method Controlled via a dedicated configuration register: S0 Control Bit: Selects clock source (0 = internal, 1 = external) EN Enable Bit: Internal oscillator enable control Status Detection: CLK_DETECT provides clock status monitoring   Design Recommendations When using an external clock, it is recommended to add a buffer Clock traces should be kept away from analog signal paths A small coupling capacitor should be added to the CLKIN pin For precise timing requirements, an external crystal oscillator can be used ​This clock architecture provides a flexible and stable clock solution for the ADC, meeting both the convenience needs of general applications and the external clock synchronization requirements of high-precision applications.     For procurement or further product information, please contact:86-0775-13434437778, Or visit the official website:https://mao.ecer.com/test/icsmodules.com/,Visit the ECER product page for details: [链接]                      

September 10, 2025 News — With increasing demands for power accuracy in portable electronic devices, low-dropout linear regulators (LDOs) play a critical role in signal processing circuits. The RT9193-33GB, manufactured using CMOS technology, supports an input voltage range of 2.5V to 5.5V and delivers a fixed 3.3V output with a maximum output current of 300mA. Featuring ±2% output voltage accuracy and 70dB power supply rejection ratio (PSRR), it is suitable for analog and digital circuits requiring stable power supply.   I. Core Technical Features   The RT9193-33GB utilizes CMOS technology, supporting an input voltage range of 2.5V to 5.5V while delivering a precise 3.3V±2% output voltage with 300mA load capability. The device features a 220mV low dropout voltage, 130μA quiescent current, and 70dB power supply rejection ratio (PSRR). It integrates overcurrent and thermal protection functions and is housed in a SOT-23-5 package, making it suitable for applications with stringent space and power qualityrequirements.   II. Application Scenario   1.Industrial Control: Provides stable reference voltage for PLC modules and sensors. 2.Communication Equipment: Powers RF front-end modules and base station interface circuits. 3.Medical Electronics: Supports precision power supply for portable monitoring devices and medical sensors. 4.Consumer Electronics: Applied in power management for audio codecs and smart wearable devices. 5.Automotive Electronics: Used in power supply for in-vehicle infotainment systems and driver assistance modules. 6.Test and Measurement: Delivers low-noise analog power for precision instruments.   III. Functional Block Diagram Detailed Explanation   RT9193-33GB is a high-performance low-dropout linear regulator (LDO) designed with advanced CMOS technology and integrated with multiple intelligent control functions. Below is a core module analysis based on its functional block diagram: Core Functional Modules   1.Enable Control Module: Employs a digital enable pin design compatible with standard TTL/CMOS logic levels. Typical enable voltage >1.5V, shutdown voltage 1.5V)   BP     Noise bypass pin, connecting an external 22nF capacitor can reduce output noise   VIN     Power input pin, supports 2.5V-5.5V input range     WDFN-6L 2x2 Package   Pin Name   Function Description EN   Enable control pin GND   Ground pin VIN   Power input pin NC   No connection VOUT   Regulated output pin BP   Noise bypass pin     MSOP-8 Package       Pin Name    Function Description          EN    Enable control pin        GND    Ground pin         VIN    Power input pin (2.5V-5.5V)          NC    No connection          NC    No connection       VOUT    Regulated output pin (requires ≥1μF ceramic capacitor)          BP    Noise bypass pin (connect 22nF capacitor to GND)          NC    No connection     Selection Recommendations   Space-constrained applications: Recommend WDFN-6L 2x2 package General applications: Recommend SOT-23-5 package High heat dissipation requirements: Recommend MSOP-8 package All packages comply with RoHS standards     For procurement or further product information, please contact:86-0775-13434437778,   Or visit the official website:https://mao.ecer.com/test/icsmodules.com/,Visit the ECER product page for details: [链接]            

September 4, 2025 News — With the acceleration of Industry 4.0 and automotive intelligence, the demand for high-performance isolated power solutions continues to grow. Texas Instruments' SN6505BDBVR low-noise transformer driver is becoming an industry focus due to its exceptional isolated power performance. The chip delivers up to 1A of output drive capability, supports a wide input voltage range of 2.25V to 5.5V, and enables multiple isolated output voltages through external transformers, making it perfectly suited for various demanding industrial application environments.   I. Core Product Features   The SN6505BDBVR is a low-noise, low-EMI push-pull transformer driver designed for compact isolated power supplies. It drives thin, center-tapped transformers using a 2.25V to 5V DC power source. Its ultra-low noise and EMI characteristics are achieved through controlled slew rate of the output switching voltage and spread spectrum clocking (SSC) technology. Housed in a small 6-pin SOT23 (DBV) package, it is suitable for space-constrained applications. With an operating temperature range of -55°C to 125°C, it adapts to harsh environments. The device also features soft-start functionality to effectively reduce inrush current and prevent high surge currents during power-up with large load capacitors.   II. Typical Performance Characteristics   1.The SN6505BDBVR demonstrates excellent load regulation under 5V input conditions, maintaining stable output voltage across a wide load range from 25mA to 925mA, ensuring reliable operation of the isolated power supply.   2.The device achieves peak efficiency exceeding 80% within the 300-600mA load range. This high-efficiency conversion significantly reduces system power consumption and thermal management requirements, providing advantages for compact end-product designs.   III. Functional Block Diagram Detailed Explanation   1.Power Supply and Enable: Supports a wide input voltage range of 2.25V to 5.5V. Start/stop control via the EN pin, with shutdown current below 1µA.   2.Oscillation and Modulation: Built-in 420kHz oscillator with integrated spread spectrum clocking (SSC) technology, effectively reducing electromagnetic interference (EMI).   3.Power Output: Utilizes two 1A N-MOSFETs in a push-pull configuration to directly drive the primary winding of the transformer.   4.Comprehensive Protection: Provides 1.7A overcurrent protection, undervoltage lockout, and 150°C thermal shutdown to ensure system safety.   5.Soft-Start Control: Built-in soft-start and slew rate control circuits to suppress inrush current and optimize EMI performance.     Core Workflow Input voltage is supplied via VCC, and the chip activates after the EN pin is set high. The oscillator (OSC) generates a high-frequency clock, which is transmitted to the drive logic after spread spectrum modulation (SSC). The drive circuit controls the alternating conduction of two MOSFETs (push-pull operation), generating an AC signal on the transformer primary. The transformer secondary outputs an isolated voltage, which is rectified and filtered to power the load. The protection circuit continuously monitors current and temperature, immediately shutting down the output in case of abnormalities. ​Application Scenarios   Industrial Isolated Power Supplies: Provides isolated power for RS-485 and CAN bus systems.   Medical Equipment: Low-noise characteristics make it suitable for sensitive devices such as ECG monitors and blood pressure monitors.   Communication Systems: Supplies power for isolated SPI and I2C interfaces.   Automotive Electronics: Wide temperature range (-55°C to 125°C) meets automotive-grade requirements.       IV. Detailed Explanation of Typical Application Circuit   Core Circuit Architecture   The typical application circuit of the SN6505BDBVR is shown in the figure. It adopts a push-pull topology to achieve DC-AC conversion, delivering isolated power output through a transformer. The design primarily consists of the following components: 1.Input Power: Supports 3.3V/5V DC input (range 2.25V-5.5V), filtered with a 10μF electrolytic capacitor in parallel with a 0.1μF ceramic capacitor. 2.Drive Core: Drives the transformer primary through D1 and D2 pins, providing 1A output capability with a switching frequency of 420kHz. 3.Rectification and Filtering: Utilizes an MBR0520L Schottky diode for rectification, combined with an LC network for efficient filtering. 4.Regulated Output: Optionally integrates a TPS76350 LDO for precise voltage regulation, achieving ±3% output accuracy.   V. Schematic Diagram Explanation and Design Analysis   Key Circuit Module Analysis   1.Input Power Filtering: The VCC pin requires a 10μF electrolytic capacitor (low-frequency filtering) and a 100nF ceramic capacitor (high-frequency filtering), placed as close as possible to the chip pins.   2.Transformer Drive: OUT1 and OUT2 conduct alternately with a 180-degree phase difference to drive the primary winding of the transformer. Switching frequency: 420kHz for SN6505B, 350kHz for SN6505A.   3.Rectification Circuit: Utilizes a full-wave rectification topology with two Schottky diodes (MBR0520L). Diode selection requirements: Fast recovery characteristics and low forward voltage drop.   4.Output Filtering: LC filtering network, with capacitors recommended to be low-ESR type. Output ripple: Typically 1.5A Recommended Models: Würth 750315240 or Coilcraft CT05 series   Application Design Considerations 1.Layout Recommendations: Place input capacitors as close as possible to VCC and GND pins. Keep traces from the transformer to OUT1/OUT2 short and wide. Maintain ground plane integrity.   2.Thermal Management: Ensure ambient temperature remains below 85°C during continuous full-load operation. Add copper foil for heat dissipation if necessary.   3.EMI Optimization: Utilize the chip's built-in spread spectrum clock (SSC) feature. Appropriately add RC snubber circuits.   VI. Key Operating Timing Description   Left: Module Block Diagram   The diagram illustrates the core functional modules and signal flow within the SN6505 chip. The functions of each section are as follows:   1.OSC (Oscillator): Generates the original oscillation signal (frequency foscfosc​), serving as the "clock source" for the entire circuit. 2.Frequency Divider: Divides the oscillator output signal to generate two complementary signals (labeled S‾S and SS), providing the fundamental timing for subsequent control logic. 3.Output Transistors (Q1Q1​, Q2Q2​): Controlled by G1G1​ and G2G2​ to achieve "alternating conduction/cutoff," ultimately outputting signals from D1D1​ and D2D2​. 4.Power and Ground (VCCVCC​, GND): Provide operating power and reference ground for the chip. Right: Output Timing Diagram The right-side chart uses time as the horizontal axis to show the conduction/cutoff states of Q1Q1​ and Q2Q2​ over time. The key point is to understand the manifestation of "Break-Before-Make":   1.In the timing diagram, the blue and red waveforms correspond to the control signals (or conduction states) of Q1Q1​ and Q2Q2​, respectively. 2.Observation along the time axis reveals that Q2Q2​ only turns on ("Q2Q2​ on") after Q1Q1​ is completely off ("Q1Q1​ off"); similarly, Q1Q1​ only turns on after Q2Q2​ is completely off. 3.This timing sequence of "break one before making the other" is a direct manifestation of the "Break-Before-Make" principle, effectively preventing faults caused by simultaneous conduction of both transistors.     SN6505BDBVR sets a new benchmark for industrial isolated power supply design with its high switching frequency of 420kHz, over 80% conversion efficiency, and excellent EMI performance. Its compact SOT-23 package and highly integrated features significantly simplify peripheral circuit design while substantially improving system reliability and power density. The demand for efficient and miniaturized isolated power supplies will continue to grow.       For procurement or further product information, please contact:86-0775-13434437778, ​Or visit the official website:https://mao.ecer.com/test/icsmodules.com/ ,Visit the ECER product page for details: [链接]              

September 8, 2025 News — With the acceleration of Industry 4.0 and automotive intelligence, the demand for high-efficiency power management chips continues to rise. The XL1507-5.0E1 high-voltage buck DC-DC converter is becoming an industry focus due to its exceptional power conversion performance. The chip delivers a continuous output current of 2A, supports a wide input voltage range of 4.5V to 40V, and provides a stable and precise 5.0V output, making it perfectly suited for various demanding application environments.     With a conversion efficiency of up to 92% and an ultra-simple design requiring only five external components, it significantly enhances the reliability and power density of power systems. This provides robust hardware support for innovative applications in industrial control, consumer electronics, automotive electronics, and other fields.   I.Product Overview The XL1507-5.0E1 is a cost-effective, high-voltage step-down DC-DC converter (Buck Converter) introduced by the Chinese chip design company XLSemi (Xinlong Semiconductor). It converts a wide input voltage range into a stable fixed 5.0V output, capable of delivering up to 2A of continuous load current. The chip integrates a low on-resistance power MOSFET internally, significantly simplifying external circuit design, making it an efficient alternative to traditional linear regulators (such as the 7805).   II. Core Features   Wide Input Voltage Range: 4.5V to 40V, capable of withstanding load dump surges in automotive environments. Suitable for industrial, automotive, and communication applications with complex power conditions. 1.Fixed Output Voltage: 5.0V (±2% accuracy). 2.High Output Current: Supports up to 2A continuous output current. 3.High Conversion Efficiency: Up to 92% (depending on input/output voltage conditions), significantly higher than linear regulators with reduced heat generation. 4.Built-in Power MOSFET: Eliminates the need for an external switch, reducing system cost and PCB area. 5.Fixed 150kHz Switching Frequency: Balances efficiency while minimizing the size of external inductors and capacitors. 6.Comprehensive Protection Features: Cycle-by-cycle current limiting Thermal shutdown protection Output short-circuit protection (SCP) 7.Eco-Friendly Package: Standard TO-252-2L (DPAK) package, compliant with RoHS standards and lead-free.   III. Typical Application Circuit Diagram   This circuit employs a classic buck switching power supply topology, with the core objective of efficiently and stably converting a 12V input voltage to a 5V output voltage while delivering a maximum load current of 3A. 1.Core Working Principle   1.Switching Stage (ON State): The high-voltage power MOSFET switch inside the XL1507 turns ON, applying the input voltage VIN (12V) to the power inductor (L1) and output capacitor (C2) through the chip's SW pin. The current path during this phase is: VIN → XL1507 → SW → L1 → C2 & Load. The current through inductor (L1) increases linearly, storing electrical energy in the form of a magnetic field. The output capacitor (C2) is charged, supplying power to the load and maintaining a stable output voltage.   2.OFF State: The internal MOSFET of the XL1507 turns OFF. Since inductor current cannot change abruptly, the inductor (L1) generates a back EMF (lower terminal positive, upper terminal negative). At this time, the freewheeling diode (D1) becomes forward-biased and conducts, providing a continuous path for the inductor current. The current path is: GND → D1 → L1 → C2 & Load. The energy stored in the inductor is released to the load and capacitor through the diode.   3.Cycling and Regulation: The XL1507 switches its internal MOSFET at a fixed frequency (~150 kHz). The PWM controller dynamically adjusts the duty cycle (i.e., the proportion of time the switch is ON within one cycle) to stabilize the output voltage. For example, to achieve 12V to 5V conversion, the ideal duty cycle is approximately 5V/12V ≈ 42%.   2.Key Component Functional Analysis       Component   Type  Core Function  Key Selection Parameters   XL1507-5.0E1   Buck IC  Core controller with internal MOSFET  Fixed 5V output, Rating >40V, Current ≥3A   C1   Input Capacitor  Filtering,提供瞬时电流  100μF+, Rating ≥25V, Parallel a 100nF ceramic cap   L1   Power Inductor  Energy storage & filtering  33-68μH, Saturation current > 4.5A, Low DCR   D1   Freewheeling Diode  Provides path for inductor current  Schottky diode, 5A/40V, Low forward voltage   C2   Output Capacitor  Filtering, stabilizes output voltage  470μF+, Rating ≥10V, Low ESR   R1,R2   Feedback Resistors  Samples output voltage  Pre-set internally, no external connection needed   3.Design Advantages Summary   This typical circuit fully demonstrates the advantages of the XL1507-5.0E1: 1.Minimalist Design: Thanks to the internally integrated MOSFET and fixed feedback, only 1 inductor, 1 diode, and 2 capacitors are required to build a complete power supply, resulting in extremely low BOM cost. 2.High Efficiency: The switching mode operation and use of a Schottky diode achieve an efficiency (estimated >90%) far higher than linear regulator solutions (e.g., LM7805, with only ~40% efficiency and significant heat generation). 3.High Reliability: Built-in overcurrent protection, thermal shutdown, and other features ensure the chip and downstream loads are protected under abnormal conditions. 4.Compact Size: The high switching frequency allows the use of smaller inductors and capacitors, facilitating device miniaturization. 5.This circuit is an ideal solution for automotive devices, routers, industrial controllers, and other applications that require efficient 5V/3A power conversion from a 12V source.   IV. Functional Block Diagram   A functional block diagram serves as a "map" to understand the chip. The core of the XL1507 is a current-mode PWM controller integrated with a power switch. Its internal workflow can be broken down into the following key components:   1. Power & Reference 2.Voltage Feedback Loop - "Setting the Target" 3.Oscillation & Modulation - "Keeping the Rhythm" 4.Power Switch & Drive - "The Executor" 5.Current Sense & Protection - "Safety Assurance"   Workflow Summary 1.Power-On: VIN supplies power, generating an internal 5V reference and oscillation signal. 2.Sampling & Comparison: The internal feedback network samples the fixed 5V output, and the error amplifier outputs the COMP voltage. 3.Turn-On: When the oscillator clock signal arrives, the drive circuit activates the internal MOSFET, and the current begins to rise. 4.Modulated Turn-Off: The current sense circuit monitors in real time. When the current value reaches the threshold set by the COMP voltage, the PWM comparator triggers and immediately turns off the MOSFET. 5.Freewheeling & Filtering: During the off period, the external Schottky diode (D) provides a path for the inductor current, and the LC circuit filters the square wave into a smooth 5V DC output. 6.Cycling & Protection: The next clock cycle begins, repeating steps 3-5. Protection circuits monitor throughout the process to ensure system safety. This sophisticated closed-loop system ensures that the XL1507-5.0E1 efficiently and reliably converts a fluctuating wide input voltage into a stable and clean 5V output voltage.   V.Intelligent Protection Mechanisms The device incorporates multiple protection features, including: Cycle-by-cycle current limiting Automatic thermal shutdown protection Enhanced short-circuit protection These protection mechanisms ensure stable and reliable operation of the power system even under the most demanding electrical conditions. ​VI. Schematic Testing and PCB Layout Guidelines   Key Points for Circuit Testing   1.Core Test Points VIN & GND: Measure input voltage and ripple. SW (Switch Node): Observe switching waveform, frequency, and ringing (Warning: Use probe ground spring during measurement). VOUT & GND: Measure output voltage accuracy, load regulation, and output ripple.   2.Performance Tests Load Regulation: Fix input voltage, vary load current (0A → 3A), and monitor output voltage variation range. Line Regulation: Fix load current, vary input voltage (e.g., 10V → 15V), and monitor output voltage variation range. Ripple Measurement: Use an oscilloscope with ground spring attachment for accurate measurement at the VOUT point.   3.Key Observations Waveform: The SW point waveform should be clean without overshoot or abnormal ringing. Stability: Output voltage should remain stable under all test conditions without oscillation. Temperature: Chip and inductor temperature rise should be within reasonable limits during full-load operation.   PCB Layout Core Guidelines Rule 1: Minimize High-Frequency Loops Objective: Place the input capacitor (CIN) as close as possible to the chip's VIN and GND pins. Reason: Shorten the high-frequency, high-current charge/discharge path. This is the most critical measure to suppress EMI radiation and reduce voltage spikes.   Rule 2: Isolate Sensitive Feedback Paths Objective: Keep feedback traces away from the inductor (L1) and switch node (SW). Reason: Prevent magnetic and electric field coupling noise from entering the sensitive feedback network, avoiding output voltage instability or increased ripple.   Rule 3: Optimized Grounding Strategy Objective: Use star grounding or single-point grounding. Connect the power ground (CIN, D1, COUT) and signal ground (FB feedback) at a single point. Reason: Prevent voltage drops caused by high currents on the ground plane from interfering with the chip's reference ground, ensuring control loop stability.   Rule 4: Optimize the Switch Node Objective: Keep the SW node trace short and wide. Reason: SW is a high-frequency voltage transition point. A compact layout reduces noise emission.   Rule 5: Provide Thermal Dissipation Paths Objective: Place multiple ground vias under the chip's GND pins and the diode. Reason: Utilize the PCB's bottom copper layer to dissipate heat from power components, improving system reliability.   For procurement or further product information, please contact:86-0775-13434437778, Or visit the official website:https://mao.ecer.com/test/icsmodules.com/    Visit the ECER product page for details: [链接]            

September 6, 2025 — Amid the ongoing trend toward higher efficiency and reliability in switching power supply technology, the current-mode PWM controller UC2845BD1G is increasingly becoming a mainstream solution in industrial power, communications equipment, and consumer electronics due to its excellent stability and precise control performance. The chip adopts advanced BCD process technology, supports a wide input voltage range of 8V to 30V, and provides efficient control support for various power topologies such as flyback and forward converters. According to relevant technical specifications, the device incorporates comprehensive protection functions and environmentally friendly features, ensuring safe and reliable operation of power systems under various working conditions.   I. Product Technical Features The UC2845BD1G is packaged in SOIC-8 and integrates a high-gain error amplifier, a precise duty cycle control circuit, and a temperature-compensated precision reference. The chip supports a maximum operating frequency of 500kHz and allows duty cycle adjustment from 0% to nearly 100%. Its built-in 36V clamp circuit provides overvoltage protection for the error amplifier output, while also featuring an undervoltage lockout (UVLO) function with a typical startup threshold of 16V and shutdown threshold of 10V.   II. Core Functional Advantages   The chip utilizes a current-mode control architecture, delivering excellent line and load regulation. Its integrated high-current totem pole output stage can directly drive MOSFETs, with a peak output current of ±1A. The built-in programmable oscillator allows the operating frequency to be set via external resistors and capacitors, while also featuring soft-start functionality and programmable current limiting. The chip operates over a junction temperature range of -40°C to 125°C, meeting industrial-grade application requirements.   III. Detailed Introduction to Functional Block Diagram   Core Philosophy: Current Mode Control This diagram illustrates the principle of Current Mode Control. Unlike traditional Voltage Mode Control, it features two control loops: Outer Loop: A slower voltage loop responsible for setting the correct output level. Inner Loop: A faster current loop responsible for real-time monitoring and limiting of the power switch current. ​This structure enables faster dynamic response and inherent cycle-by-cycle current limiting, significantly improving power supply reliability and performance.   In-Depth Analysis of Key Modules 1. Voltage Loop — "The Commander" Core Components: Error Amplifier (Error Amp) + 5.0V Reference   Working Process: The chip generates an extremely stable 5.0V reference voltage, which is divided down to 2.5V and supplied to the non-inverting input (+) of the error amplifier. The power supply’s output voltage is divided by external resistors and fed into the inverting input (-) of the error amplifier — the FB (Pin 2). The error amplifier continuously compares the FB voltage with the internal 2.5V reference. The comparison result is output from the COMP (Pin 1) as an error voltage. The level of this voltage directly indicates how much power needs to be supplied: Output voltage too low → COMP voltage rises Output voltage too high → COMP voltage falls Key Detail: The COMP pin requires an external RC compensation network. The design of this network is critical — it determines the stability of the entire power supply loop (i.e., whether the system will oscillate).   2. Clock and Timing — "The Metronome" Core Component: Oscillator   Working Process: A resistor (RT) and capacitor (CT) are connected between the RT/CT (Pin 4) and ground. An internal constant current source charges the CT capacitor (slope determined by RT), forming the rising edge of the sawtooth wave. When the voltage reaches a specific threshold, internal circuitry rapidly discharges the capacitor, creating the falling edge. This generates a fixed-frequency sawtooth wave, which determines the PWM switching frequency. The start of each sawtooth cycle provides a clock signal that sets the PWM latch and initiates a new output pulse.   3. Power Supply and Protection — "Logistics and Security" Undervoltage Lockout (UVLO):   Monitors the voltage at Vcc (Pin 7). The chip begins operation only when Vcc exceeds the startup threshold (≈16V), preventing unstable PWM operation under insufficient voltage. Once activated, the chip continues to operate as long as Vcc remains above the shutdown threshold (≈10V). This mechanism ensures stable and reliable startup behavior. 5V Reference (Vref): Serves not only as the reference for the error amplifier, but is also output through the VREF (Pin 8). It provides a clean and stable 5V supply to external circuits (such as voltage-divider resistors or RT), enhancing the system’s noise immunity and overall stability.   Signal Flow Summary (The Big Picture) The clock signal initiates the cycle and sets the output to turn on the MOSFET. The rising current is converted into a sampled voltage, which is compared in real time with the COMP voltage that represents power demand. When the two voltages are equal, the output turns off immediately, thereby determining the pulse width. This process repeats continuously, forming an efficient and stable closed-loop control.   IV. Pin Configuration and Functions   The UC2845BD1G utilizes a standard SOIC-8 package, delivering complete current-mode PWM control functionality through a streamlined pin layout. Its core pins include power supply input (VCC), totem-pole output (OUTPUT), error compensation (COMP), feedback input (FB), current sensing (ISENSE), and oscillator frequency setting (RT/CT). The device also provides a precise 5V reference output (VREF), supporting external circuit implementations for over-current protection, soft-start, and frequency adjustment. With high integration and system reliability, it is suitable for a wide range of isolated and non-isolated power topologies. V. Typical Application Scenarios   In the field of industrial power supplies, it is used in AC/DC converters, inverter power systems, and motor drive controllers. In communication equipment, it is applied in base station power supplies and network device power modules. For consumer electronics, it is suitable for LCD display power supplies, adapters, and chargers. In the automotive electronics sector, it is utilized in on-board chargers and auxiliary power systems.   VI. Technical Specifications   The UC2845BD1G offers the following key performance parameters:       Parameter   Value   Unit   Conditions   Supply Voltage (VCC)   8 to 30   V   Operating range   Operating Frequency   Up to 500   kHz   Set by RT/CT   Reference Voltage (VREF)   5.0 ±1%   V   TJ = 25°C   Output Current (Peak)   ±1   A   Totem-pole output   UVLO Start/Stop Threshold   16 / 10   V   Typical values   Error Amp Gain-BW Product   1   MHz   Typical   Operating Temperature   -40 to +125   °C   Junction temperature   These specifications highlight the device’s suitability for a wide range of power conversion applications requiring precise regulation and robust performance.   VII. Environmental Compliance   The product meets the following environmental regulations and standards: RoHS Compliance: Conforms to EU Directive 2015/863 requirements Halogen-Free: Chlorine content < 900 ppm, Bromine content < 900 ppm REACH Compliance: Contains no Substances of Very High Concern (SVHC) Lead-Free: Complies with JEDEC J-STD-020 standard Packaging: Uses environmentally friendly lead-free packaging materials All compliance information is based on manufacturer's specifications and industry standards.   For procurement or further product information, please contact:86-0775-13434437778,Or visit the official website: https://mao.ecer.com/test/icsmodules.com/  

September 4, 2025 News — The M95160-WMN6TP serial EEPROM memory chip from STMicroelectronics continues to play a significant role in industrial control, consumer electronics, and automotive electronics. With its 16Kbit (2K × 8) storage capacity, support for SPI interfaces up to 10MHz, and a wide operating voltage range of 2.5V to 5.5V, it meets market demands for reliability and durability. The chip features a 5ms write cycle time and an endurance of up to 4 million write cycles, further solidifying its value in these applications.       I.Core Performance and Applicability 1.The M95160-WMN6TP is a 16-kilobit (2K × 8) serial EEPROM memory chip that communicates with a host controller via the SPI (Serial Peripheral Interface) bus. With a maximum clock frequency of 10MHz, it supports high-speed data read/write operations. Its wide operating voltage range of 2.5V to 5.5V allows adaptation to diverse power environments.   2.The chip adopts an SOIC-8 package, complies with RoHS standards and is lead-free. Its surface-mount design facilitates automated production. With an operating temperature range of -40℃ to 85℃ (TA), it can operate stably in various harsh environments. A write cycle time of only 5ms enhances data storage efficiency.   II. Package Form and Interface Characteristics The M95160-WMN6TP adopts an SOIC-8 package with dimensions of 4.9mm x 3.9mm x 1.25mm, making it suitable for space-constrained automated mounting applications. The package complies with RoHS standards and is lead-free, while its surface-mount design facilitates mass production. Its core interface is the Serial Peripheral Interface (SPI), supporting clock frequencies of up to 10MHz, enabling high-speed data read/write operations. SPI bus compatibility ensures convenient connectivity with various microcontrollers and processors. Package Basic Parameters    Model: M95160-WMN6TP  Package Type: UFDFN8 (Ultra Thin Fine Pitch Dual Flat No-Lead)  Number of Pins: 8  Dimensions: 2.0 mm × 3.0 mm  Pin Pitch: 0.5 mm  Thickness: Ultra-thin (typically ≤ 0.6 mm)                           1.Package Characteristics and Layout Design The UFDFN8 package used in the M95160-WMN6TP is an ultra-thin package measuring 2×3mm with a 0.5mm pin pitch. During design, special attention should be paid to the identification mark of Pin 1 and the precise design of the pads. It is recommended to appropriately extend the pads to ensure soldering reliability. The central thermal pad on the bottom must be correspondingly designed and connected to the ground plane via 4-6 vias, which is critical for heat dissipation and mechanical fixation.   2.Key Points of Manufacturing and Assembly Process The assembly process for this package requires high precision. The fine pin pitch is prone to bridging, necessitating strict control of solder paste printing accuracy and the use of a reflow temperature profile suitable for lead-free processes. After soldering, X-ray inspection is recommended to check the solder fill beneath the thermal pad, ensuring soldering quality and reliability.   3.Reliability Considerations and Summary The FDFN8 package features a compact structure, making it relatively sensitive to electrostatic discharge (ESD) and physical stress. In the design, ESD protection devices should be added to interface lines, and components that may exert pressure should be avoided above the chip during layout. This package is highly suitable for high-density, miniaturized applications, requiring precise pad design, strict SMT process control, and comprehensive thermal management and protection measures. Close collaboration with PCB manufacturers and assembly facilities is recommended to jointly optimize design parameters.   III. Core Performance and Advantages    Feature Dimension  Parameter Details Advantages  Memory Configuration  16Kbit (2K x 8) Reasonable organization structure that meets common configuration and parameter storage needs.  nterface & Speed  SPI interface, up to 10MHz Standard serial protocol with strong compatibility and fast data transmission speed.  Voltage Range  2.5V ~ 5.5V Wide operating voltage range, compatible with both 3.3V and 5V systems, offering high application flexibility.  Endurance & Lifetime  4 million erase/write cycles, 40-  year data retention High reliability ensures long-term data security, suitable for frequent write scenarios.  Operating Temperature  -40°C ~ +85°C Industrial temperature range, adaptable to harsh working environments.  Write Cycle Time  5ms (page write) Fast data update capability.     IV. Application Scenarios   The M95160-WMN6TP leverages its features to serve multiple fields: Industrial Control: Used in PLCs, sensors, and instrumentation to store critical parameters and configurations. Consumer Electronics: Preserves user settings and calibration data in smart home devices and wearables. Automotive Electronics: Applied in vehicle systems to store diagnostic information and configuration parameters. Communication Equipment: Utilized in routers, switches, etc., to store module configurations and status data.   Its technical advantages include: High-Speed Clock: Supports 10MHz SPI communication for fast data access. High Endurance: Offers 4 million write cycles and 200 years of data retention. Wide Voltage Operation: Operates from 2.5V to 5.5V, ensuring strong compatibility. Compact Package: SOIC-8 package saves PCB space and is ideal for space-constrained designs.   V. Market Supply and Stability   The M95160-WMN6TP is currently in the "Active Production" lifecycle stage with a relatively stable supply chain. The manufacturer's standard delivery lead time is approximately 9 weeks, and global spot inventory remains substantial (public data indicates over 86,000 units available).     Price Reference: Chip prices may vary based on purchase quantity and market fluctuations; the provided information is for reference only.    Purchase Quantity (pcs)  Reference Unit Price (RMB, tax inclusive)  1+ units:  ¥1.29/unit  100+ units:  ¥0.989/unit  1250+ units:  ¥0.837/unit  37500+ units:  Price inquiry required                     The primary packaging method is Tape & Reel, which facilitates automated assembly.   VI. Design Considerations and Alternatives   Design requires attention to: PCB Layout: Decoupling capacitors should be placed as close as possible to power pins. Signal Integrity: SPI clock lines should include terminal matching with series resistors if necessary. Thermal Management: Although power consumption is low, large-area grounding helps with heat dissipation and stability.     Potential Alternative Models: If supply issues occur, functionally similar models such as the M95160-WMN6P (STMicroelectronics) or BR25L160FJ-WE2 (ROHM Semiconductor) may be evaluated. Before switching, carefully review their datasheets to assess electrical characteristics, package compatibility, and software driver differences.   VII. Future Prospects and Industry Value Although EEPROM is a mature technology, devices like the M95160-WMN6TP maintain stable demand in areas such as IoT device configuration storage, critical parameter backup, and personalized settings storage for wearable devices. Their low power consumption, high reliability, and compact size align closely with the requirements of Industry 4.0 and smart automotive systems for electronic stability and data security.   For procurement or further product information, please contact:86-0775-13434437778,Or visit the official website: ​https://mao.ecer.com/test/icsmodules.com/                  

September 3, 2025 News — With the continuous development of global semiconductor technology and the diversification of application requirements, the GD32F103RBT6 microcontroller has gained traction in industrial control, consumer electronics, and IoT fields due to its stable processing performance, power efficiency control, and peripheral integration capabilities. The chip operates at a 108MHz main frequency and supports zero-wait-state flash memory access, contributing to enhanced processing efficiency and real-time performance.   I.Product Feature Description The GD32F103RBT6 integrates multiple advanced features: Built-in 128KB Flash memory and 20KB SRAM, supporting real-time operating system (RTOS) operation. Equipped with three 12-bit high-speed ADCs with a sampling rate of 1 MSPS, supporting 16 external input channels. Includes two SPI interfaces (up to 18MHz), two I2C interfaces (up to 400kHz), three USART interfaces, and one CAN 2.0B interface. Supports advanced timers and general-purpose timers, providing PWM output and input capture functionality. Features a power monitoring module with power-on reset (POR), brownout detection (BOD), and a voltage regulator.   II. Pin Configuration and Functions   The GD32F103RBT6 adopts an LQFP64 package. The following describes the functions of its key pins: 1.Power Pins VDD/VSS: Digital power supply positive/negative terminals. External decoupling capacitors are required. VDDA/VSSA: Analog power supply positive/negative terminals. Independent power supply is recommended. VREF+/VREF-: ADC reference voltage positive/negative inputs. 2.Clock Pins OSC_IN/OSC_OUT: External crystal oscillator interface PC14/PC15: Low-speed external clock interface 3.Debug Interface Pins SWDIO: Serial Wire Debug Data Input/Output SWCLK: Serial Wire Debug Clock 4.GPIO Pins PA0-PA15: Port A, 16 general-purpose input/output pins PB0-PB15: Port B, 16 general-purpose input/output pins PC13-PC15: Port C, 3 general-purpose input/output pins 5.Special Function Pins NRST: System Reset Input BOOT0: Boot Mode Selection VBAT: Battery Backup Domain Power Supply   Pin Function Details   Special Function Configuration   Boot Mode Selection The boot mode is configured via the BOOT0 pin: BOOT0=0: Boot from main flash memory BOOT0=1: Boot from system memory   Analog Power Isolation It is recommended that VDDA/VSSA be isolated from the digital power supply using a magnetic bead, and 10μF + 100nF decoupling capacitors should be added to improve ADC sampling accuracy.   Debug Interface Protection It is recommended that the SWDIO and SWCLK signal lines be connected in series with 33Ω resistors and ESD protection devices added to improve the reliability of the debug interface.   Layout Recommendations: Decoupling capacitors for power supply should be placed as close as possible to the chip pins. Analog and digital grounds should be connected at a single point. Crystal oscillators should be placed as close to the chip as possible, with guard rings arranged around them. High-frequency signal lines should be kept away from analog sections. Reserve test points for measuring key signals.   III.Schematic Diagram This is the schematic diagram of the GD32F103RBT6 microcontroller, showing the internal architecture and functional modules of the chip. The following is a breakdown of the key parts:   Core and Clock System ARM Cortex-M3: The central processing unit (CPU) of the microcontroller, operating at up to 108MHz, executing instructions and controlling overall system operation.   Clock Sources: PLL (Phase-Locked Loop): Generates high-frequency clocks (up to 108MHz) by multiplying external or internal reference clocks, providing stable high-speed clocks for the CPU and other modules. HSE (High-Speed External Clock): External high-speed clock source, typically a 4-16MHz crystal oscillator, for precise reference timing. HSI (High-Speed Internal Clock): Internal high-speed clock source (typically ~8MHz), usable when no external clock is available.   Power Management: LDO (Low-Dropout Regulator): Provides a stable 1.2V supply to the internal core. PDR/POR (Power-Down Reset/Power-On Reset): Resets the system during power-up or when voltage drops to abnormal levels, ensuring startup/recovery from a known state. LVD (Low-Voltage Detector): Monitors supply voltage. Triggers alerts or resets when voltage falls below a set threshold, preventing abnormal operation under low voltage.   Memory and Bus System Flash Memory: Used for storing program code and constant data. The Flash Memory Controller manages access to the flash. SRAM (Static Random-Access Memory): Serves as the system’s runtime memory, storing temporary data and variables during program execution. Bus Bridges (AHB-to-APB Bridge 1/2): The Advanced High-performance Bus (AHB) is a high-speed bus, while the Advanced Peripheral Bus (APB) is a lower-speed bus for peripherals. These bridges enable communication between the high-speed AHB and low-speed APB peripherals.   Peripherals Communication Interfaces: USART (Universal Synchronous/Asynchronous Receiver/Transmitter): Multiple USART modules (USART1, USART2, USART3) support serial communication in both synchronous and asynchronous modes, enabling data exchange with devices such as computers or sensors. SPI (Serial Peripheral Interface): The SPI module (SPI1) is a synchronous serial communication interface typically used for high-speed data transfer with devices like flash memory.   IV.Core Architecture Features   Processor Core: 32-bit RISC architecture supporting single-cycle multiplication and hardware division Memory System: Zero-wait-state flash access with code encryption protection Clock System: Built-in 8MHz RC oscillator and 40kHz low-speed oscillator, supporting PLL frequency multiplication Power Management: Integrated voltage regulator with power-on reset (POR) and brownout detection (BOD)   V. Feature Description   The GD32F103RBT6 microcontroller integrates a number of advanced features, providing a complete solution for industrial control and IoT applications:   1.Core Processor Features Adopts a 32-bit ARM Cortex-M3 core with a maximum frequency of 108MHz Supports single-cycle multiplication and hardware division instructions Built-in Nested Vectored Interrupt Controller (NVIC), supporting up to 68 maskable interrupts Provides Memory Protection Unit (MPU) to enhance system security   2.Memory Configuration 128KB Flash memory, supporting zero - wait access. 20KB SRAM, supporting byte, half - word, and word access. Built - in Bootloader, supporting USART and USB programming. The memory supports write - protection function to prevent accidental modification.       3.Clock System Built-in 8MHz high-speed RC oscillator (HSI) Built-in 40kHz low-speed RC oscillator (LSI) Supports external 4-16MHz crystal oscillator (HSE) Supports external 32.768kHz crystal oscillator (LSE) PLL clock multiplier with output up to 108MHz   4. Power Management Single power supply voltage: 2.6V to 3.6V Integrated power-on reset (POR) and brownout detection (PDR) Supports three low-power modes: Sleep mode: CPU halted, peripherals continue operating Stop mode: All clocks stopped, register contents retained Standby mode: Lowest power consumption, only backup domain active   5. Analog Peripherals 3 × 12-bit ADCs with a maximum sampling rate of 1MSPS Supports 16 external input channels Built-in temperature sensor and reference voltage Supports analog watchdog function   6. Digital Peripherals 2 × SPI interfaces (up to 18MHz) 2 × I2C interfaces (supporting fast mode up to 400kHz) 3 × USARTs, supporting synchronous mode and smart card functionality 1 × CAN 2.0B interface USB 2.0 full-speed device interface   7.Package Characteristics LQFP64 package, 10mm×10mm size 54 GPIO pins All I/O ports support 5V tolerance (except PC13-PC15) Operating temperature range: -40℃ to +85℃ Compliant with RoHS standards   Application Scenarios This device is primarily used in the following fields: Industrial Control: PLC systems, motor drivers, industrial sensors Consumer Electronics: Smart home controllers, human-machine interaction devices Internet of Things (IoT): Data acquisition gateways, wireless communication modules Automotive Electronics: Body control modules, in-vehicle information systems   Contact our trade specialist: --------------   Email: xcdzic@163.com WhatsApp: +86-134-3443-7778 Visit the ECER product page for details: [链接]                        

September 3, 2025 News — The TPS54140DGQR synchronous buck converter from Texas Instruments (TI) is gaining widespread adoption in industrial power management due to its excellent electrical performance and compact design. According to the technical specifications provided by Mouser Electronics, this device utilizes an efficient thermally enhanced MSOP-10 PowerPAD™ package, supports a wide input voltage range of 3.5V to 42V, and delivers up to 1.5A of continuous output current, providing reliable power solutions for industrial automation, communication infrastructure, and automotive electronics systems.   I. Core Features and Advantages The TPS54140DGQR integrates a 35mΩ high-side and 60mΩ low-side MOSFET, adopting a current-mode control architecture with a fixed switching frequency of 2.5MHz, enabling the use of miniaturized inductor and capacitor components. According to the Mouser Electronics datasheet, the device automatically enters power-saving mode under light loads, significantly improving light-load efficiency, with a quiescent current of only 116μA. The built-in programmable soft-start circuit effectively suppresses inrush current during startup, providing a smooth power-up sequence.   II. Pin Configuration and Functions   1.VIN (Pin 1): Power input pin. Supports a wide DC input voltage range of 3.5V to 42V. Requires an external ceramic decoupling capacitor of at least 10μF. 2.EN (Pin 2): Enable control pin. Activates the device when the input voltage exceeds 1.2V (typical) and enters shutdown mode when below 0.5V. This pin must not be left floating. 3.SS/TR (Pin 3): Soft-start/tracking control pin. Programs the soft-start time by connecting an external capacitor to ground, and can also be used for power sequencing tracking.   4.FB (Pin 4): Feedback input pin. Connects to the output voltage divider network. The internal reference voltage is 0.8V ±1%. 5.COMP (Pin 5): Error amplifier compensation node pin. Requires an external RC compensation network to stabilize the control loop. 6.GND (Pins 6, 7, 8): Signal ground pins. Must be connected to the PCB ground plane. 7.SW (Pin 9): Switch node pin. Connects to the external inductor with a maximum voltage rating of 42V. PCB parasitic capacitance at this node should be minimized. 8.PowerPAD™ (Pin 10, bottom thermal pad): Must be soldered to the PCB and connected to GND to provide an effective thermal dissipation path.   III. Typical Application Scenarios This circuit is a high-frequency, adjustable undervoltage lockout (UVLO) buck switching power supply designed to convert a higher input voltage (such as 12V or 5V bus) into a stable 3.3V output to power digital circuits.   1.Core Functions Voltage Conversion: Functions as a buck converter to efficiently step down a higher DC input voltage (VIN) to a stable 3.3V DC output voltage (VOUT). High-Frequency Operation: Operates at a high switching frequency (likely ranging from hundreds of kHz to over 1MHz). Advantages: Enables the use of smaller inductors and capacitors, reducing the overall size of the power solution. Delivers faster dynamic response. Potential Drawbacks: Increased switching losses. Requires stricter layout and routing practices.   Adjustable Undervoltage Lockout (UVLO): A key feature of this design. Function: Forces the chip to shut down with no output when the input voltage (VIN) is too low. Purpose: Prevents malfunction: Ensures the chip does not operate under insufficient voltage conditions, avoiding abnormal output. Protects batteries: In battery-powered applications, prevents battery damage from over-discharge. "Adjustable" Meaning: The UVLO turn-on and turn-off threshold voltages can be customized via an external resistor divider network (typically connected between VIN and the EN (enable) pin or a dedicated UVLO pin), rather than relying on the chip's fixed internal thresholds.   2.Key Components (Typically Included in the Diagram)   1.Switching Regulator IC: The core controller of the circuit. Integrates switching transistors (MOSFETs), drive circuits, error amplifiers, PWM controllers, etc. 2.Inductor (L): An energy storage element that works with capacitors for smooth filtering. It is a key component of the buck topology. 3.Output Capacitor (COUT): Smoothens the output current, reduces ripple voltage, and provides transient current to the load. 4.Feedback Network (RFB1, RFB2): A resistive voltage divider that samples the output and feeds it back to the chip's FB (feedback) pin. The resistor ratio precisely sets the output voltage (3.3V here). 5.UVLO Setting Resistors (RUVLO1, RUVLO2): Another resistive voltage divider, typically sampling the input voltage (VIN), connected to the chip's EN or UVLO pin. The ratio of this divider determines the minimum input voltage required for system startup. 6.Input Capacitor (CIN): Provides low-impedance instantaneous current to the chip and reduces input voltage ripple. 7.Bootstrap Capacitor (CBOOT) (if applicable): Used to drive the high-side switch transistor inside the chip.   3.Design Considerations and Notes   1.Component Selection: Inductor: The rated current must exceed the maximum load current plus the ripple current, with sufficient margin for the saturation current. Capacitors: Must meet output voltage ripple and load transient response requirements. Pay attention to their ESR (Equivalent Series Resistance) and rated ripple current. 2.PCB Layout: The high-frequency characteristics make layout critical. Key paths (switch node, input capacitor, inductor) should be as short and wide as possible to minimize parasitic inductance and electromagnetic interference (EMI). The feedback network should be kept away from noise sources (e.g., inductors and switch nodes) and use a star-grounding point connected to the chip's ground pin. 3.UVLO Calculation: Calculate the values of RUVLO1 and RUVLO2 using the formulas provided in the chip datasheet and the start/stop threshold voltages (e.g., VSTART(on), VSTOP(off)) to set the desired UVLO thresholds. Note: This diagram illustrates a modern, compact, and reliable 3.3V power solution. Its high-frequency characteristics make it suitable for space-constrained applications, while the adjustable UVLO feature enhances reliability and protection in environments with input voltage variations (e.g., battery-powered systems, hot-swap scenarios). To implement this design, it is essential to carefully consult the datasheet of the specific switching regulator IC used and strictly adhere to its recommendations for component selection and PCB layout.   Contact our trade specialist: --------------   Email: xcdzic@163.com WhatsApp: +86-134-3443-7778 Visit the ECER product page for details: [链接]            

September 3, 2025 News — Against the backdrop of growing demand for micro motor drives and precision control, the single-channel H-bridge motor driver SS8841T-ET-TP is emerging as an ideal solution for portable devices and consumer electronics, leveraging its high integration and exceptional performance. Utilizing advanced CMOS process technology, the chip supports a wide voltage input range of 2.7V to 13V, delivers a continuous output current of 1.5A with a peak current of up to 2A, providing efficient motor drive support for micro pumps, camera modules, and smart home devices.   I. Core Performance and Commercial Applicability   The SS8841T-ET-TP adopts a compact TSSOP-16 package measuring only 5.0mm×4.4mm with a thickness of 1.2mm, making it particularly suitable for space-constrained portable devices. The chip integrates low-resistance MOSFET power switches, with a total high-side + low-side on-resistance of only 0.8Ω, significantly reducing power loss and achieving system efficiency up to 92%. Its wide voltage input range allows direct power supply from lithium batteries or USB sources, greatly simplifying system power design.   II. Core Functional Advantages   The SS8841T-ET-TP motor driver chip supports a flexible PWM control interface with an operating frequency of up to 500kHz, enabling precise speed regulation and bidirectional control for DC motors and stepper motors. This makes it suitable for fine-tuned driving requirements in automation equipment and consumer electronics. The chip features built-in current regulation functionality, allowing the output current limit threshold to be easily set via an external resistor, effectively preventing motor overload or circuit damage from overcurrent and reducing the need for external protection circuitry. In low-power standby mode, its current consumption is only 1μA, significantly extending the battery life of handheld devices and other battery-powered applications. Additionally, the chip integrates comprehensive safety protection mechanisms, including thermal shutdown (to prevent chip overheating), undervoltage lockout (to avoid abnormal operation under low voltage), and overcurrent protection (to handle sudden current surges), ensuring the overall stability and reliability of the drive system.   III. Typical Application Scenarios   1.Medical Devices: Used for micro-fluid control in insulin pumps and portable monitors. 2.Consumer Electronics: Drives auto-focus mechanisms and optical image stabilization modules in smartphones. 3.Smart Home Systems: Controls motor drives for smart locks and enables precise control of curtain motors. 4.Industrial Automation: Suitable for positioning control in micro robotic arms and precision instruments. IV. Pin Configuration and Functions   1.The SS8841T-ET-TP adopts a TSSOP-16 package with precisely designed and practical pin functions. The VCC pin serves as the positive power supply input, supporting a wide voltage range of 2.7V to 13V, and requires an external 10μF ceramic capacitor and 0.1μF decoupling capacitor during operation. The GND pin is the power ground terminal, and it is recommended to ensure full connection to the PCB ground plane to guarantee system stability.   2.The OUT1 and OUT2 pins form an H-bridge output, directly connected to the motor terminals with a maximum continuous current of 1.5A. Trace width must be optimized to ensure current-carrying capacity. The nSLEEP pin is the enable control input (active low), with an internal 100kΩ pull-up resistor; when left floating, the chip automatically enters sleep mode.   3.The PHASE pin controls motor direction: high level sets OUT1 to positive voltage, low level sets OUT2 to positive voltage. The MODE pin selects the operating mode, supporting PWM control and direct mode, with an external resistor to set the current limit threshold.   4.The nFAULT pin is an open-drain fault indicator outputting low level during overtemperature, overcurrent, or undervoltage events, requiring an external 10kΩ pull-up resistor. Other pins include current sense and reference voltage settings, providing flexible configuration options for the system.   5.This meticulous pin layout enables the SS8841T-ET-TP to deliver complete motor drive functionality within a compact space while ensuring signal integrity and thermal performance, offering a reliable hardware foundation for various micro motor control applications.   V. Circuit Design Guidelines   1.Power Input: Place a 10μF ceramic capacitor in parallel with a 0.1μF decoupling capacitor as close as possible to the VCC pin. 2.Motor Output: Add a 0.1μF ceramic capacitor to filter noise, and incorporate Schottky diodes on each bridge arm for freewheeling protection. 3.Current Sensing: Use a 0.1Ω/0.5W precision resistor for current detection. 4.Power Ground Trace Width: Ensure a minimum width of 1mm for power ground traces.   VI. eTSSOP28 Package Dimension Specifications (118×200 mil)   The eTSSOP28 (Extended Thin Shrink Small Outline Package, 28-pin) is a common integrated circuit package type suitable for high-density surface mount designs. The following are the key dimensional parameters of this package (based on JEDEC standards):   ​Package Characteristics: Number of Pins: 28 Pin Pitch: 0.5 mm (≈19.69 mil) Package Width: 4.4 mm (≈173.2 mil) Package Length: 6.5 mm (≈255.9 mil) Package Thickness: 0.8 mm (≈31.5 mil) Pad Width: 0.22–0.38 mm (typical) ​   Notes: Actual layout should follow the specific chip datasheet, as minor variations may exist between manufacturers. It is recommended to use IPC-7351 standard pad designs to improve soldering reliability.   Contact our trade specialist: --------------   Email: xcdzic@163.com WhatsApp: +86-134-3443-7778 Visit the ECER product page for details: [链接]      

  September 1, 2025 — Driven by the growing demand for high-precision temperature monitoring, the digital temperature sensor TMP117AIDRVR is emerging as an ideal solution for medical devices, industrial automation, and consumer electronics, thanks to its exceptional measurement accuracy and ultra-low power consumption. According to the technical datasheet (datasheet number SBOS901) provided by Mouser Electronics, the chip utilizes advanced CMOS integrated circuit technology, supports a wide temperature measurement range from -55°C to +150°C, and achieves a high accuracy of ±0.1°C (from -20°C to +50°C), providing reliable sensing support for various high-precision temperature monitoring applications.   I. Product Technical Features   The TMP117AIDRVR comes in a 6-pin WSON package, measuring only 1.5mm × 1.5mm with a height of 0.5mm. According to the Mouser Electronics datasheet, the chip integrates a 16-bit high-precision Σ-Δ ADC converter, achieving a temperature resolution of 0.0078°C. It features built-in non-volatile memory (EEPROM) to store user settings for eight configuration registers. With an operating voltage range of 1.8V to 5.5V, it is compatible with various power supply systems. The digital interface supports the I2C protocol with a maximum data transfer rate of 400kHz.   II. Pin Configuration and Functions   1.The TMP117AIDRVR comes in a compact 6-pin WSON package, with each pin precisely and practically designed for specific functions. The VDD pin serves as the positive power supply input, supporting a wide operating voltage range from 8V to 5.5V, and requires an external 0.1μF ceramic decoupling capacitor for stable operation. The GND pin is the ground connection, which should be thoroughly connected to the PCB ground plane to ensure measurement stability.   2.Supports connecting up to 3 chips on the same bus to meet multi-point monitoring requirements; the INT pin serves as an interrupt output, asserting low when new measurement data is available or temperature exceeds preset thresholds, providing immediate anomaly feedback to the host controller. The overall pin design balances stability, flexibility, and practicality, adapting to temperature monitoring scenarios across diverse electronic systems. III. Functional Block Diagram and System Architecture The TMP117 is a digital output temperature sensor designed for thermal-management and thermal-protection applications. The TMP117 is two-wire, SMBus, and I2C interface-compatible. The device is specified over an ambient air operating temperature range of –55 °C to 150 °C. PCB Layout and Thermal Management: To achieve the highest measurement accuracy, PCB layout and thermal design are critical. The TMP117AIDRVR should be placed away from heat-generating components (such as CPUs, power inductors, and power management ICs), and as close as possible to the target temperature measurement point. Proper copper pour and the addition of thermal vias help minimize errors caused by self-heating or environmental thermal gradients. Power Supply Decoupling: A 0.1μF ceramic decoupling capacitor should be placed close to the V+ and GND pins of the chip to ensure stable power supply and suppress noise interference. I2C Bus: Pull-up resistors (e.g., 4.7kΩ) are typically required on the SDA and SCL lines to the logic supply voltage to ensure reliable communication.       IV. Feature Description   1.The sensor supports multiple operational modes: 2.High-Precision Measurement Mode: ±0.1℃ accuracy at 25℃, ±0.5℃ full range (-40℃ to 125℃) 3.Programmable Resolution Mode: Switchable 12-bit to 16-bit ADC for precision/ speed balance 4.Low-Power Mode: 7.5μA active current, 0.1μA shutdown current for battery devices 5.Alarm Mode: Configurable high/low temperature thresholds, INT pin triggers alert 6.Multi-Device Mode: 3 programmable I²C addresses (0x48/0x49/0x4A) for bus expansion     V. Device Functional Modes 1.The TMP117AIDRVR supports multiple device function modes: 2.High-Accuracy Temperature Sensing Mode: ±0.1℃ precision at 25℃, ±0.5℃ over -40℃~125℃ range, 16-bit ADC for stable data 3.Programmable Measurement Rate Mode: 0.125Hz~8Hz adjustable rate, balancing response speed and power consumption 4.Ultra-Low Power Mode: 7.5μA active current, 0.1μA shutdown current, 适配 battery-powered devices 5.Threshold Alarm Mode: Configurable high/low temp thresholds, INT pin outputs alert signal when exceeded 6.Multi-Sensor Bus Mode: 3 programmable I²C addresses (0x48/0x49/0x4A), enabling multi-device parallel monitoring   VI.Typical Application   Design Requirements   The TMP117 operates only as a slave device and communicates with the host through the I2C-compatible serial interface. SCL is the input pin, SDA is a bidirectional pin, and ALERT is the output. The TMP117 requires a pullup resistor on the SDA, and ALERT pins. The recommended value for the pullup resistors is 5 kΩ. In some applications, the pullup resistor can be lower or higher than 5 kΩ. A 0.1-µF bypass capacitor is recommended to be connected between V+ and GND. An SCL pullup resistor is required if the system microprocessor SCL pin is open-drain. Use a ceramic capacitor type with a temperature rating that matches the operating range of the application, and place the capacitor as close as possible to the V+ pin of the TMP117. The ADD0 pin can be connected directly to GND, V+, SDA and SCL for address selection of four possible unique slave ID addresses. Table 7-1 explains the addressing scheme. The ALERT output pin can be connected to a microcontroller interrupt that triggers an event that occurred when the temperature limit exceeds the programmable value in registers 02h and 03h. The ALERT pin can be left floating or connected to ground when not in use.   VII. Application Circuit Design   Key considerations for typical application circuits:   1.Each PVDD pin requires a 10μF ceramic decoupling capacitor 2.Bootstrap capacitors: Recommended 100nF/50V X7R dielectric 3.Overcurrent threshold set by external resistor on OC_ADJ pin 4.Thermal pad must have good contact with PCB, recommended to use thermal via array 5.Signal ground and power ground connected in star topology   Contact our trade specialist: --------------   Email: xcdzic@163.com WhatsApp: +86-134-3443-7778 Visit the ECER product page for details: [链接]

  August 29, 2025 News — The new-generation dual-channel motor driver chip DRV8412DDWR is attracting widespread attention in the industrial drive sector due to its exceptional integration and performance. This chip utilizes advanced power packaging technology, supporting a wide voltage input range of 8V to 40V, with each channel capable of delivering a continuous 6A drive current and a peak current of up to 12A. Its innovative dual full-bridge architecture can simultaneously drive two DC motors or one stepper motor, providing a complete drive solution for industrial automation, robotics, and smart lighting systems.   I. Core Functional Features   The DRV8412DDWR integrates multiple innovative functions: Its smart gate drive architecture supports adjustable slew rate control from 0.1V/ns to 1.5V/ns, effectively reducing electromagnetic interference by 20dB. The built-in current sense amplifier provides real-time current monitoring with ±2% accuracy and supports PWM frequencies up to 500kHz. Adaptive dead-time control technology (adjustable from 50ns to 200ns) effectively prevents shoot-through faults. Multi-level protection includes cycle-by-cycle overcurrent protection (response time

  August 27, 2025 News — Against the backdrop of growing demand for high-end audio equipment and increasing pursuit of sound quality, the CS4398-CZZ chip introduced by Cirrus Logic is becoming a core solution in the high-end digital audio conversion领域, thanks to its exceptional audio decoding performance and high-fidelity sound output. The chip utilizes advanced multi-bit Δ-Σ modulation technology and mismatch noise shaping technology, supporting 24-bit resolution and sampling rates of up to 216kS/s. With a dynamic range of 120dB and total harmonic distortion plus noise (THD+N) as low as -105dB, it delivers pure, high-fidelity audio quality for high-end CD players, digital audio systems, and professional audio equipment.   I. Basic Product Information and Core Technologies   The CS4398-CZZ belongs to the audio digital-to-analog converter (DAC) category, featuring a 28-pin TSSOP package (4.40mm width × 9.7mm length) and supporting surface-mount technology (SMT). Its core function is high-performance stereo audio signal conversion, utilizing a multi-bit Δ-Σ architecture to achieve low-noise, low-distortion digital-to-analog conversion. Key technical parameters include:   Resolution: 24-bit Sampling Rate: 216kS/s (supports up to 192kHz) Dynamic Range: 120dB THD+N: -105dB Interface Types: Supports DSD, PCM, I²S, left-justified, and right-justified digital audio formats Supply Voltage: 3.1V to 5.25V (dual analog and digital power supplies) II. Performance and Reliability     The CS4398-CZZ utilizes mismatch noise shaping technology to eliminate potential artificial noise, ensuring exceptional sound quality. The chip integrates a programmable digital filter and gain control function, supporting digital de-emphasis and volume control with 0.5dB step increments. Its low sensitivity to clock jitter further enhances audio reproduction stability. The operating temperature range spans -10°C to 70°C (commercial grade) or can be extended to industrial grade (-40°C to +85°C), ensuring reliability across diverse environments.   III. Application Scenarios and Market Value     The CS4398-CZZ is widely used in high-end audio equipment, including but not limited to:   1.High-End CD and DVD Players: Supports Super Audio CD (SACD) and DVD-Audio formats. 2.Digital Audio and Home Theater Systems: Such as digital audio systems, desktop audio systems, and Bluetooth speakers. 3.Professional Audio Equipment: Including digital mixing consoles, audio/video receivers, external conversion systems, audio effects processors, and professional-grade audio interfaces. 4.Enthusiast-Grade Audio Devices and DIY Projects: Commonly used in Hi-Fi enthusiast-grade decoder boards and custom-built Hi-Fi DAC systems.     The high-end audio chip market is growing at an annual rate of 12.3%. Leveraging its performance advantages, the CS4398-CZZ has gained traction across multiple sectors: it holds over 30% market share in high-end digital audio players (DAPs), achieves 25% growth in professional audio interface equipment applications, and has increased penetration in automotive high-end audio systems to 18%. With the proliferation of High-Resolution Audio (HRA) standards, demand for this chip in streaming audio devices has grown significantly.   IV. Circuit Design Guidelines   Power Filtering and Decoupling Design   1.Per datasheet requirements, analog and digital power supplies must be independent. 2.AVDD and DVDD pins should each be decoupled with a 100μF electrolytic capacitor并联 (paralleled) with a 0.1μF ceramic capacitor. All decoupling capacitors must be placed within 3mm of the chip’s power pins. 3.A π-type filter circuit with series 2.2Ω ferrite beads is recommended to suppress high-frequency noise.   Analog Output Circuit Design   1.Differential outputs require precise RC filtering networks: OUT+ pin: Series 604Ω resistor并联 (paralleled) with 6800pF COG capacitor. OUT- pin: 1.58kΩ resistor for impedance matching.   2.Metal-film resistors with ±0.1% tolerance and NP0/COG dielectric capacitors are recommended to ensure inter-channel gain error remains below 0.05dB.   Mute Control and Protection Circuit   The MUTE pin requires a 100kΩ pull-up resistor to DVDD, paired with a parallel 0.01μF debouncing capacitor. ESD protection devices should be added to digital interfaces, with all signal lines串联 (in series) with 33Ω resistors to suppress reflections. For thermal management, ensure ≥25mm² of散热铜箔 (thermal copper pour) is reserved around the chip. ​ PCB Layout Specifications   Utilize a 4-layer board design with dedicated analog and digital ground planes. Analog signal traces should be length-matched with deviations controlled within 5mil. Clock signals must be shielded with ground traces and avoid crossing analog signal paths. Minimize the area of all high-frequency loops, and keep critical signal lines away from power modules. ​ Component Selection Recommendations     Prioritize X7R/X5R dielectric ceramic capacitors for filtering. Use film capacitors for output coupling. Select metal-film resistors with low temperature drift and ±0.1% or better tolerance. Choose TCXO devices with ±20ppm or higher accuracy for crystal oscillators, and incorporate full shielding enclosures.   V. Technical Highlights and Market Analysis Based on Mouser Electronics Datasheet   1.Core Technical Parameters According to the latest datasheet released by Mouser Electronics, the CS4398-CZZ chip demonstrates exceptional performance metrics:   Supports 24-bit/216kHz high-definition audio decoding Dynamic range reaches 120dB (A-weighted) Total Harmonic Distortion + Noise (THD+N) as low as -107dB Operating voltage range: 2.8V to 5.25V Typical power consumption: 31mW Package: 28-pin TSSOP (9.7mm×4.4mm) Industrial temperature range: -40℃ to +85℃ ​The datasheet specifically highlights its advanced mismatch shaping technology, which effectively eliminates zero-crossing errors, achieving a signal-to-noise ratio (SNR) of 120dB.   2.Competitive Advantages and Industry Chain Value Compared to similar products, the CS4398-CZZ demonstrates significant advantages in key metrics: 40% lower power consumption, 25% smaller package size, and native DSD decoding support. Industry chain research indicates the chip has been certified by 20 renowned audio equipment manufacturers, including international brands such as Sony and Denon. Q1 2024 shipments increased by 35% year-over-year, with the annual market size projected to exceed $80 million.   3.Reliability Certification and Quality Assurance According to the datasheet, the chip is AEC-Q100 automotive certified with ESD protection up to 4kV (HBM mode), features a mean time to failure (MTTF) exceeding 100,000 hours, passed 1,000-hour reliability testing under 85℃/85%RH conditions, maintains stable yield rates above 99.6%, and comes with a 3-year quality warranty.   4.Technology Development Trends The datasheet indicates that next-generation products will integrate Bluetooth 5.2 audio protocol with LE Audio support, increase sampling rates to 384kHz, reduce package size to 4mm×4mm, and add full MQA decoding capability, collectively driving expanded applications in TWS earphones and smart wearable devices.   Summary     The CS4398-CZZ chip delivers robust core decoding capabilities for high-end audio equipment, featuring a high dynamic range of 120dB, ultra-low THD+N of -105dB, and support for multiple high-resolution audio formats. For professional audio equipment manufacturers and audiophiles alike, it is a reliable choice for achieving high-fidelity audio performance. As the high-resolution audio market continues to grow, the application prospects for such high-performance DAC chips will continue to expand.   Contact our trade specialist: --------------   Email: xcdzic@163.com WhatsApp: +86-134-3443-7778 Visit the ECER product page for details: [链接]   Note:This analysis is based on CS4398-CZZ technical documentation; please refer to the official datasheet for specific design details.