USB3300-EZK Chip Empowers Smart Manufacturing Upgrades
August 26, 2025 News — Shenzhen Anxinruo Technology Co., Ltd., a company specializing in high-end interface chip design, has established its USB3300-EZK chip as a key solution in the industrial-grade USB physical layer transceiver market. The product utilizes advanced ULPI (Ultra Low Pin Interface) technology, reducing the traditional UTMI+ interface’s 54 signals to just 12 pins, significantly optimizing space utilization and wiring complexity. Compliant with USB 2.0 specifications, the chip supports High-Speed (480Mbps), Full-Speed (12Mbps), and Low-Speed (1.5Mbps) transfer modes, while integrating OTG (On-The-Go) functionality to meet modern devices’ demands for bidirectional data transfer and power management. Its industrial temperature range (-40℃ to 85℃) and 3V to 3.6V wide-voltage power supply ensure stable performance in harsh environments.
The USB3300-EZK belongs to the USB Physical Layer Transceiver (PHY) category, featuring a 32-pin QFN package (5mm×5mm size) and supporting surface-mount technology (SMT). Its core function is high-speed signal conversion and link layer bridging, enabling seamless connectivity with host controllers via the ULPI interface to reduce system latency and power consumption. Key technical parameters include:
Data Transfer Rate: 480Mbps (High-Speed mode)
1.Power Management:
Unconfigured current 54.7mA (typical)
Suspend mode current 83μA
2.Protection Capabilities:
Built-in ESD protection
Supports ±8kV HBM (Human Body Model)
IEC61000-4-2 ESD compliance (Contact discharge: ±8kV, Air discharge: ±15kV)
3.Clock Integration:
Built-in 24MHz crystal oscillator
Supports external clock input
The chip is USB-IF High-Speed certified and compliant with USB 2.0 Specification Revision standards. For reliability, its latch-up performance exceeds 150mA (meeting EIA/JESD 78 Class II), and it integrates short-circuit protection to safeguard ID, DP, and DM lines against accidental shorts to VBUS or ground. Testing in industrial temperature environments demonstrates a bit error rate below 10⁻¹², fulfilling demands for continuous high-load operation.
The USB3300-EZK is widely used in consumer electronics, industrial automation, and automotive electronics. In industrial control systems, its high reliability supports real-time data exchange. In automotive electronics, it serves as an interface for in-vehicle infotainment and navigation systems. Its low-power characteristics make it particularly suitable for portable medical devices and battery-powered IoT sensor nodes, enabling miniaturization and improved energy efficiency in end devices.
Shenzhen Anxinruo Technology Co., Ltd. has optimized the chip's power consumption and area efficiency through innovative design, with its technical team focusing on independent R&D of high-speed interface chips. Market feedback indicates that the chip has been successfully integrated into the supply chains of multiple industrial equipment manufacturers and consumer electronics brands, enabling applications in high-end printers, smart home hubs, and data acquisition devices. Industry analysis suggests that with the growing demands of Industry 4.0 and automotive electronics, the high-performance USB-PHY chip market is projected to achieve an annual growth rate of 12.8%.
Overall Architecture
As shown in the diagram, the USB3300 adopts a modular design integrating four core modules: power management, clock generation, physical layer transceiver, and digital interface. The chip connects to the link layer controller via the ULPI (UTMI+ Low Pin Interface) standard, significantly reducing the number of interface pins.
Power Management Module
1.Multi-Voltage Domain Design: Supports dual voltage inputs of 3.3V (VDD3.3) and 3.8V (VDD3.8), integrating high-efficiency voltage regulators.
2.Power Sequencing Control: Built-in Power-On Reset (POR) circuit ensures sequential activation of all modules.
3.5V-Tolerant Interface: EXTVBUS pin directly connects to 5V power sources with integrated internal protection circuitry.
Clock System
1.Dual Clock Source Support: Compatible with 24MHz external crystal oscillators or clock input signals.
2.PLL Frequency Multiplication: Internal phase-locked loop multiplies the reference clock to 480MHz to meet high-speed mode timing requirements.
3.Clock Output Function: CLKOUT pin provides synchronized clock signals to external controllers.
USB Physical Layer Transceiver
1.Multi-Rate Compatibility:
High-Speed mode (480 Mbps): Current-driven architecture
Full-Speed mode (12 Mbps): Voltage-mode driver
Low-Speed mode (1.5 Mbps): Supports low-speed device connectivity
2.Adaptive Termination Resistance:
Integrates internal matching resistor network supporting dynamic impedance adjustment
3.Signal Integrity Assurance:
Utilizes differential signaling architecture with pre-emphasis and equalization processing
Design Guidelines
1.Power Decoupling:
Each power pin requires a 0.1μF ceramic capacitor; additional 1μF tantalum capacitors are recommended.
2.Clock Accuracy:
The 24MHz clock source must have a frequency tolerance better than ±50ppm to ensure compliance with USB timing specifications.
3.PCB Layout:
Differential signal pair length mismatch should be less than 5mil.
Maintain 90Ω differential impedance control.
Avoid crossing high-speed signal lines with sensitive analog circuits.
4.ESD Protection:
TVS diode arrays are recommended for DP/DM lines.
Overvoltage protection circuitry is required for the VBUS pin.
Application Notes
1.Cascade Control: Multiple PHY devices can be cascaded and controlled via the CEN pin.
2.Bias Resistor Requirement: The RBIAS pin must be connected to a precision resistor (1% tolerance) to set the reference current.
3.Power Saving: Energy-saving modes can significantly reduce standby power consumption in portable devices.
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Note:This analysis is based on USB3300-EZK technical documentation; please refer to the official datasheet for specific design details.