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Power Module Thermal Management Technology

 Company Resources About Power Module Thermal Management Technology

August 19, 2025 News — Against the rapid development of new energy and industrial power electronics, the 600V Field-Stop IGBT FGH60N60UFD is emerging as a core power device for photovoltaic inverters, industrial welding equipment, and UPS systems, thanks to its excellent conduction and switching characteristics. Featuring advanced field-stop technology, the device offers a low saturation voltage drop of 1.9V and switching losses of 14μJ/A, delivering a reliable solution for high-efficiency power conversion.

 

I. Key Product Technical Highlights

 

High-Efficiency Power Architecture
  The FGH60N60UFD adopts a TO-247-3 package and integrates a field-stop IGBT structure, delivering a remarkably low saturation voltage drop of just 1.9V at 60A operating current—reducing conduction losses by 20% compared to conventional IGBTs. Its optimized carrier storage layer design enables ultra-low turn-off energy of 810μJ, supporting high-frequency switching beyond 20kHz.

 

Enhanced Reliability Design

Temperature Resilience: Junction temperature range of -55°C to 150°C, meeting industrial-grade environmental demands

 Robustness Assurance: 600V breakdown voltage and 180A pulsed current capability for transient surge immunity

 Eco-Compliance: RoHS-compliant, free from restricted hazardous substances

 

Key Performance Parameters

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II. Typical Application Scenarios

 

1.Photovoltaic Inverter Systems

  In string inverters, this device achieves over 98.5% conversion efficiency through optimized gate driving (recommended 15V drive voltage). Its fast reverse recovery characteristic (trr=47ns) reduces diode freewheeling losses by 46%.

2.Industrial Welding Equipment
  When used in the main power circuit of arc welding machines, paired with water cooling solutions (thermal resistance <0.5°C/W), it supports continuous 60A current output with a temperature rise controlled at ΔT<30K, ensuring prolonged stable operation.

3.Data Center UPS
  In 20kHz high-frequency PFC circuits, the device reduces switching losses by 35% compared to silicon-based MOSFETs, increasing system efficiency to over 96% and significantly minimizing energy waste.

 

III. Circuit Design Guidelines

1. Drive Circuit Design

Gate Resistor Selection:

Based on the formula,Recommended initial value: 5Ω (requires real-world optimization)

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Protection Circuit:

Parallel 18V Zener diode between gate and source to prevent overvoltage breakdown

Add Miller clamp circuit to suppress bridge arm crosstalk

2.Thermal Management Solution

Heat Sink Selection:

Based on the power dissipation formula,Under 60A/20kHz operating conditions, the device requires dissipation of ≥50W. It is recommended to use an aluminum-based heatsink with thermal resistance <1.5°C/W.Power Module Thermal Management Technology

Installation Process:

Apply thermal grease (K≥3W/mK)

Fastening torque must be controlled within 0.6Nm ±10%

3. PCB Layout Specifications

Power Loop:

Utilize Kelvin connections to minimize parasitic inductance

Maintain ≥2mm spacing between positive/negative copper traces (for 600V systems)

Signal Isolation:

Use twisted-pair or shielded wiring for drive signals

Implement single-point connection between power ground and signal ground

IV. Technological Trends and Market Outlook

 

Amid the accelerating global energy transition, the third-generation field-stop IGBT technology represented by the

 

FGH60N60UFD is embracing new growth opportunities. In the photovoltaic power generation sector, the device’s

 

compatibility with string inverters continues to improve, with its global market share projected to exceed 35% by 2026. In

 

industrial applications, its exceptional cost-performance advantage maintains its dominance in medium-power equipment

 

below 200kW, particularly in welding machines and servo drives, where its penetration rate has reached 42%.


 

 

At the technological innovation level, next-generation products will evolve in the following directions:

 

1.Intelligent Integration: Built-in temperature sensors and fault diagnosis circuits

 

2.Material Optimization: Adoption of novel passivation layer technology to reduce switching losses by an additional 15%

 

3.Packaging Innovation: Development of TO-247-4 pin packaging to enable Kelvin emitter connections


 

Market analysis indicates that the global IGBT market will grow at a compound annual growth rate (CAGR) of 8.7% from

 

2025 to 2030, with new energy applications accounting for over 55% of this growth. Leveraging its low conduction voltage

 

drop of 1.9V and superior switching characteristics, the FGH60N60UFD is poised to occupy a strategically significant position

 

in this expansion.

 

V. Typical Application Circuit Schematics

 

Photovoltaic Inverter Half-Bridge Circuit

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Key Component Specifications:

 

D1/D2: Fast recovery diodes (Trr < 50ns)

C1/C2: Low-ESR electrolytic capacitors

L1: Iron-silicon aluminum toroidal inductor

 

VI. Industrial Welding Machine Application Circuit

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Design Key Points:

 

Triple parallel design with current-sharing resistors (0.1Ω/5W)

Nanocrystalline core transformer to reduce eddy current losses

Drive signal synchronization error <100ns

 

 

Note: This analysis is based on publicly available technical documentation. For detailed design, please refer to the official datasheet FGH60N60UFD Rev.1.