The Foundation of Data Security for Embedded Devices

^{September 4, 2025 News — The M95160-WMN6TP serial EEPROM memory chip from STMicroelectronics continues to play a significant role in industrial control, consumer electronics, and automotive electronics. With its 16Kbit (2K × 8) storage capacity, support for SPI interfaces up to 10MHz, and a wide operating voltage range of 2.5V to 5.5V, it meets market demands for reliability and durability. The chip features a 5ms write cycle time and an endurance of up to 4 million write cycles, further solidifying its value in these applications.}

^{1.The M95160-WMN6TP is a 16-kilobit (2K × 8) serial EEPROM memory chip that communicates with a host controller via the SPI (Serial Peripheral Interface) bus. With a maximum clock frequency of 10MHz, it supports high-speed data read/write operations. Its wide operating voltage range of 2.5V to 5.5V allows adaptation to diverse power environments.}

^{2.The chip adopts an SOIC-8 package, complies with RoHS standards and is lead-free. Its surface-mount design facilitates automated production. With an operating temperature range of -40℃ to 85℃ (TA), it can operate stably in various harsh environments. A write cycle time of only 5ms enhances data storage efficiency.}

^{The M95160-WMN6TP adopts an SOIC-8 package with dimensions of 4.9mm x 3.9mm x 1.25mm, making it suitable for space-constrained automated mounting applications. The package complies with RoHS standards and is lead-free, while its surface-mount design facilitates mass production.}

^{Its core interface is the Serial Peripheral Interface (SPI), supporting clock frequencies of up to 10MHz, enabling high-speed data read/write operations. SPI bus compatibility ensures convenient connectivity with various microcontrollers and processors.}

Package Basic Parameters

^{1.Package Characteristics and Layout Design}

^{The UFDFN8 package used in the M95160-WMN6TP is an ultra-thin package measuring 2×3mm with a 0.5mm pin pitch. During design, special attention should be paid to the identification mark of Pin 1 and the precise design of the pads. It is recommended to appropriately extend the pads to ensure soldering reliability. The central thermal pad on the bottom must be correspondingly designed and connected to the ground plane via 4-6 vias, which is critical for heat dissipation and mechanical fixation.}

^{2.Key Points of Manufacturing and Assembly Process
The assembly process for this package requires high precision. The fine pin pitch is prone to bridging, necessitating strict control of solder paste printing accuracy and the use of a reflow temperature profile suitable for lead-free processes. After soldering, X-ray inspection is recommended to check the solder fill beneath the thermal pad, ensuring soldering quality and reliability.}

^{3.Reliability Considerations and Summary}

^{The FDFN8 package features a compact structure, making it relatively sensitive to electrostatic discharge (ESD) and physical stress. In the design, ESD protection devices should be added to interface lines, and components that may exert pressure should be avoided above the chip during layout. This package is highly suitable for high-density, miniaturized applications, requiring precise pad design, strict SMT process control, and comprehensive thermal management and protection measures. Close collaboration with PCB manufacturers and assembly facilities is recommended to jointly optimize design parameters.}

^{The M95160-WMN6TP leverages its features to serve multiple fields:}

^{Industrial Control: Used in PLCs, sensors, and instrumentation to store critical parameters and configurations.}

^{Consumer Electronics: Preserves user settings and calibration data in smart home devices and wearables.}

^{Automotive Electronics: Applied in vehicle systems to store diagnostic information and configuration parameters.}

^{Communication Equipment: Utilized in routers, switches, etc., to store module configurations and status data.}

^{Its technical advantages include:}

^{High-Speed Clock: Supports 10MHz SPI communication for fast data access.}

^{High Endurance: Offers 4 million write cycles and 200 years of data retention.}

^{Wide Voltage Operation: Operates from 2.5V to 5.5V, ensuring strong compatibility.}

^{Compact Package: SOIC-8 package saves PCB space and is ideal for space-constrained designs.}

^{The M95160-WMN6TP is currently in the "Active Production" lifecycle stage with a relatively stable supply chain. The manufacturer's standard delivery lead time is approximately 9 weeks, and global spot inventory remains substantial (public data indicates over 86,000 units available).}

Price Reference:

Chip prices may vary based on purchase quantity and market fluctuations; the provided information is for reference only.

The primary packaging method is Tape & Reel, which facilitates automated assembly.

^{Design requires attention to:}

^{PCB Layout: Decoupling capacitors should be placed as close as possible to power pins.}

^{Signal Integrity: SPI clock lines should include terminal matching with series resistors if necessary.}

^{Thermal Management: Although power consumption is low, large-area grounding helps with heat dissipation and stability.}

^{Potential Alternative Models: If supply issues occur, functionally similar models such as the M95160-WMN6P (STMicroelectronics) or BR25L160FJ-WE2 (ROHM Semiconductor) may be evaluated. Before switching, carefully review their datasheets to assess electrical characteristics, package compatibility, and software driver differences.}

^{Although EEPROM is a mature technology, devices like the M95160-WMN6TP maintain stable demand in areas such as IoT device configuration storage, critical parameter backup, and personalized settings storage for wearable devices. Their low power consumption, high reliability, and compact size align closely with the requirements of Industry 4.0 and smart automotive systems for electronic stability and data security.}

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